Title:
保護シートおよび半導体ウエハの加工方法
Document Type and Number:
Japanese Patent JP4558345
Kind Code:
B2
Inventors:
Katsuhiko Horimei
Ohashi Hitoshi
Kazuhiro Takahashi
Ohashi Hitoshi
Kazuhiro Takahashi
Application Number:
JP2004043265A
Publication Date:
October 06, 2010
Filing Date:
February 19, 2004
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/02; H01L21/02; C09J201/00; H01L21/285; H01L21/3065; H01L21/68; H01L21/683
Domestic Patent References:
| JP2003209073A | ||||
| JP2001144123A | ||||
| JP2000331962A | ||||
| JP5299881A |
Attorney, Agent or Firm:
Koji Makimura
Chihata Takahata
Toru Suzuki
Chihata Takahata
Toru Suzuki