Title:
接合基板の接合性測定
Document Type and Number:
Japanese Patent JP4559461
Kind Code:
B2
Abstract:
A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.
Inventors:
Vest, keith frank
Ghi, Chen-Kun
Stedja, Budiman
Delat, Wihelms Johannes Maria
Ghi, Chen-Kun
Stedja, Budiman
Delat, Wihelms Johannes Maria
Application Number:
JP2007252998A
Publication Date:
October 06, 2010
Filing Date:
September 28, 2007
Export Citation:
Assignee:
AS M Netherlands B.V.
International Classes:
H01L21/68; H01L21/02; H05K3/00
Domestic Patent References:
| JP2000223391A | ||||
| JP2006186367A | ||||
| JP2004165670A | ||||
| JP2005294800A |
Foreign References:
| WO2003085723A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki
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