Title:
セラミック基板、電子装置およびセラミック基板の製造方法
Document Type and Number:
Japanese Patent JP4561831
Kind Code:
B2
Abstract:
A high-reliability ceramic substrate that does not cause a heat-cycle-induced stress concentration on a conductor and that include a glass layer partially overlaying the conductor, the glass layer having satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance is provided. An electronic apparatus and a method for producing the ceramic substrate are provided. The glass layer is a glass layer 13 which is arranged to extend from part of the conductor formed on a first main surface of the main body of the ceramic substrate to the first main surface of the main body of the ceramic substrate and which has a double-layered structure including a first glass sublayer 11 composed of a first glass material; and a second glass sublayer 12 formed on the first glass sublayer and composed of a second glass material different from the second glass material constituting the first glass sublayer, the first glass material having more satisfactory adhesion to the main body of the ceramic substrate than the second glass material, and the first glass material having more satisfactory plating resistance than the first glass material.
Inventors:
Tohru Meguro
Ryuichiro Wada
Yoshifumi Saito
Ryuichiro Wada
Yoshifumi Saito
Application Number:
JP2007508660A
Publication Date:
October 13, 2010
Filing Date:
November 13, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/28
Domestic Patent References:
| JP2005191102A | 2005-07-14 | |||
| JPS63302594A | 1988-12-09 | |||
| JPH0918144A | 1997-01-17 |
Attorney, Agent or Firm:
Hitoshi Nishizawa