Title:
感熱性粘着シートの熱活性化方法および装置と該装置を備えたプリンタ
Document Type and Number:
Japanese Patent JP4563163
Kind Code:
B2
Abstract:
The objectives of the present invention are to provide a device (110) for the thermal activation of a heat-sensitive adhesive sheet (101), and a method therefor, that can improve the reliability with which the adhesive property of a heat-sensitive adhesive layer is manifested, and a printer that includes the device. According to the present invention, a thermal activation method, for manifestation of the adhesive quality of a heat-sensitive adhesive layer deposited on a heat-sensitive adhesive sheet (101), includes a step of: applying thermal energy (111,501) to locations on of the heat-sensitive adhesive sheet (101), that varies in consonance with the location (f(x),g(y)).
Inventors:
Tatsuya Ohbuchi
Minoru Hoshino
Takanashi Masanori
Minoru Hoshino
Takanashi Masanori
Application Number:
JP2004359815A
Publication Date:
October 13, 2010
Filing Date:
December 13, 2004
Export Citation:
Assignee:
Seiko Instruments Inc.
International Classes:
B65C9/25; G09F3/00; G09F3/10
Domestic Patent References:
| JP2004053756A | ||||
| JP2001088814A |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura