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Patent Searching and Data


Title:
薄膜集積回路の作製方法
Document Type and Number:
Japanese Patent JP4566578
Kind Code:
B2
Inventors:
荒井 康行
石川 明
高山 徹
丸山 純矢
後藤 裕吾
大野 由美子
舘村 祐子
Application Number:
JP2004048421A
Publication Date:
October 20, 2010
Filing Date:
February 24, 2004
Export Citation:
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Assignee:
株式会社半導体エネルギー研究所
International Classes:
B42D15/10; H01L21/02; B65D25/20; G06K19/07; G06K19/077; G09F3/00; H01L21/336; H01L27/12; H01L29/786
Domestic Patent References:
JP2003045890A
JP61206304A
JP2002164512A
JP2003044808A
JP11243209A
JP2001176896A
JP2002353235A
JP2001331120A
JP2001007340A
JP2001166301A
JP10125929A
JP2002133385A
JP2002230141A
JP9270515A
Foreign References:
WO2003010825A1