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Title:
エピタキシャルウエハ基板用に強化されたn型シリコン材料及びその製造方法
Document Type and Number:
Japanese Patent JP4567262
Kind Code:
B2
Abstract:
An enhanced n+ silicon material for epitaxial substrates and a method for producing it are described. The enhanced material leads to improved gettering characteristics of n/n+ epitaxial wafers based on these substrates. The method for preparing such n+ silicon material includes applying a co-doping of carbon to the usual n dopant in the silicon melt, before growing respective CZ crystals. This improves yield of enhanced n+ silicon material in crystal growing and ultimately leads to device yield stabilization or improvement when such n/n+ epitaxial wafers are applied in device manufacturing.

Inventors:
Kirshut Fritz Gee
Wilds Peterdi
Todd Volker Earl
Fukuto no Bro
Susnerev Boris A
Kim sun fly
Application Number:
JP2001511716A
Publication Date:
October 20, 2010
Filing Date:
July 12, 2000
Export Citation:
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Assignee:
Samco Oregon Corporation
International Classes:
C30B29/06; C30B15/00; C30B15/04; H01L21/205; H01L21/322
Domestic Patent References:
JP3164495A
JP3183685A
Other References:
Scott A. MCHUGO et al.,A study of gettering efficiency and stability in Czochralski silicon,Applied Physics Letters,1995年 5月22日,Vol. 66, No. 21,p. 2840-2842
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda