Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4568308
Kind Code:
B2
Inventors:
Norihiko Tsuchiya
Ushihisa Yukihiro
View Yuichi
Atsuko Kawasaki
Kaori Umezawa
Ushihisa Yukihiro
View Yuichi
Atsuko Kawasaki
Kaori Umezawa
Application Number:
JP2007204066A
Publication Date:
October 27, 2010
Filing Date:
August 06, 2007
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L29/78; H01L21/265; H01L21/336
Domestic Patent References:
| JP4099037A | ||||
| JP7273326A | ||||
| JP9064355A | ||||
| JP10178172A | ||||
| JP4360541A | ||||
| JP5291288A | ||||
| JP3244134A | ||||
| JP59132674A | ||||
| JP7066152A | ||||
| JP63221647A | ||||
| JP3159119A | ||||
| JP7122742A | ||||
| JP2000138177A |
Attorney, Agent or Firm:
Hiroshi Horiguchi