Title:
導電壁を備えたプラズマ処理装置。
Document Type and Number:
Japanese Patent JP4568467
Kind Code:
B2
Abstract:
The plasma processing apparatus comprises a plasma chamber (1) bounded, on at least one side thereof, by an electrically conductive wall (10), said electrically conductive wall comprising one or several apertures (100) for interrupting a current path through said wall, external electromagnetic means (2) for supplying electromagnetic energy into the plasma chamber through the electrically conductive wall, thereby generating a plasma inside said chamber, and sealing means for sealing the apertures. The apparatus is characterised in that the sealing means comprises one or more electrically conductive enclosure elements (16) which are electrically insulated from the electrically conductive wall.
Inventors:
Korpo, Pascal
Rossi, Francois
Rossi, Francois
Application Number:
JP2001537769A
Publication Date:
October 27, 2010
Filing Date:
September 29, 2000
Export Citation:
Assignee:
European Community (Easy)
International Classes:
H01L21/205; B01J19/08; H05H1/46; C23C14/34; C23C16/505; H01J37/32
Domestic Patent References:
| JP8148472A | ||||
| JP10055983A | ||||
| JP10255997A | ||||
| JP10284299A | ||||
| JP2002503030A | ||||
| JP2002537648A |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Hiroshi Kida
Shinsuke Onuki
Tadashige Ito
Hiroshi Kida