Title:
半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP4570806
Kind Code:
B2
Inventors:
Hirofumi Harada
Jun Oyamauchi
Jun Oyamauchi
Application Number:
JP2001113048A
Publication Date:
October 27, 2010
Filing Date:
April 11, 2001
Export Citation:
Assignee:
Seiko Instruments Inc.
International Classes:
H01L21/8238; H01L29/43; H01L21/8234; H01L27/088; H01L27/092; H01L29/423; H01L29/49; H01L29/78
Domestic Patent References:
| JP9129868A | ||||
| JP8055914A | ||||
| JP8186179A | ||||
| JP4335538A | ||||
| JP11354794A | ||||
| JP6334120A | ||||
| JP2000223705A | ||||
| JP11307729A | ||||
| JP9260663A | ||||
| JP2000323706A | ||||
| JP2000188397A | ||||
| JP2000323654A |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura