Title:
積層型半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4570809
Kind Code:
B2
Abstract:
In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
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Inventors:
Kikuhi Kikuma
Ikeda Mitsutaka
Sakikan Yoshihiro
Yuji Akashi
Ozawa Kaname
Akira Takashima
Tadashi Uno
Takao Nishimura
Fumihiko Ando
Yutaka Onodera
Okuda Hayato
Ikeda Mitsutaka
Sakikan Yoshihiro
Yuji Akashi
Ozawa Kaname
Akira Takashima
Tadashi Uno
Takao Nishimura
Fumihiko Ando
Yutaka Onodera
Okuda Hayato
Application Number:
JP2001121539A
Publication Date:
October 27, 2010
Filing Date:
April 19, 2001
Export Citation:
Assignee:
Fujitsu Semiconductor Limited
International Classes:
H01L23/12; H01L25/065; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| JP11265975A | ||||
| JP11274397A | ||||
| JP2001223326A | ||||
| JP2001007278A | ||||
| JP2002076250A | ||||
| JP2001177050A | ||||
| JP2001257307A |
Attorney, Agent or Firm:
Tadahiko Ito