Title:
積層樹脂成形体及び多層成形品
Document Type and Number:
Japanese Patent JP4576782
Kind Code:
B2
Abstract:
The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.
Inventors:
Takeshi Inaba
Taketo Kato
Shigehito Azaka
Takuya Arase
Tetsuo Shimizu
Taketo Kato
Shigehito Azaka
Takuya Arase
Tetsuo Shimizu
Application Number:
JP2001559683A
Publication Date:
November 10, 2010
Filing Date:
February 19, 2001
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
B32B27/22; B32B27/08; B32B27/30; B32B27/34; B65D1/00; C08F210/02; C08F214/20; C08F214/22; C08F214/26; C08F214/28; C08F216/14; C08K3/04; C08K5/00; C08L27/12; C08L77/00; C08L101/02
Domestic Patent References:
| JPH06246887A | 1994-09-06 | |||
| JPH06221472A | 1994-08-09 | |||
| JPH11500177A | 1999-01-06 | |||
| JPH10311461A | 1998-11-24 | |||
| JPH11320770A | 1999-11-24 |
Foreign References:
| WO1999045044A1 | 1999-09-10 | |||
| WO1999001280A1 | 1999-01-14 |
Attorney, Agent or Firm:
Atomi International Patent Office