Title:
金属コンタクトLGAソケット
Document Type and Number:
Japanese Patent JP4577905
Kind Code:
B2
Abstract:
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.
Inventors:
Trout, david, allison
McClinton, Jeffrey, Byron
Mar, Case, McKilkin
O'Donnell, Peter, Clark
Raymond, Hollis, Paul
Sinaiishi, David, Beatty
Tailor, Atelier, Snner
Bolcer, Andrew, Douit
Fuine, Richard, Nicholas
Wurts, darrell, lynn
McClinton, Jeffrey, Byron
Mar, Case, McKilkin
O'Donnell, Peter, Clark
Raymond, Hollis, Paul
Sinaiishi, David, Beatty
Tailor, Atelier, Snner
Bolcer, Andrew, Douit
Fuine, Richard, Nicholas
Wurts, darrell, lynn
Application Number:
JP2006522079A
Publication Date:
November 10, 2010
Filing Date:
July 29, 2004
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
H01R33/76; H05K7/10; H01R13/24
Domestic Patent References:
| JP2001297812A | ||||
| JP2001085131A | ||||
| JP10223338A | ||||
| JP2001143841A | ||||
| JP2001257050A | ||||
| JP2003109717A | ||||
| JP2001524256A |
Foreign References:
| US5427535 |
Attorney, Agent or Firm:
Tyco Electronics Corporation