Title:
チップ実装方法及びその装置
Document Type and Number:
Japanese Patent JP4577941
Kind Code:
B2
Abstract:
A tool (2) is lowered to mount a chip (1) on a substrate (5) supported by a stage (4), without effects of the thermal expansion of a feed mechanism (7) of a Z-axis feed device (3), while correcting the shapes of bumps of the chip (1). The Z-axis feed device (3) vertically moves a holder support means (15) to which a tool holder (17) is attached using a static-pressure air bearing (18). The tool holder (17) is equipped with a tool (2) that carries a chip (1). The holder support means (15) is equipped with a height-detecting means (23) that detects the height of the tool holder (17) and feeds it back to drive control means (22) of the Z-axis feed device (3). The holder support means (15) includes a pressure port (19) and a balance pressure port (20).
Inventors:
Akira Yamauchi
Yoshiyuki Arai
Yoshiyuki Arai
Application Number:
JP2000103857A
Publication Date:
November 10, 2010
Filing Date:
April 05, 2000
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
G02F1/13; H01L21/60; H01L21/00; H01L21/68; H05K13/04; H05K13/08
Domestic Patent References:
| JP9153522A | ||||
| JP9153525A | ||||
| JP10032225A | ||||
| JP10340931A | ||||
| JP11040932A | ||||
| JP10163272A | ||||
| JP6002708U | ||||
| JP11297749A |