To provide a rear plane irradiation type image pickup element with high reliability at low cost.

The rear plane irradiation type image pickup element performs image pickup by irradiating light from the backside of a silicon substrate 7 and reading out the signal corresponding to the charge generated by PD10 formed in the silicon substrate 7 from a CCD formed on the front surface of the silicon substrate 7. The element includes: an embedded layer 8 of a specific material formed in a through-hole penetrating from the front surface to the back surface of the silicon substrate 7 in the surrounding circuit area; and an alignment mark 6 formed on an exposed surface of a front surface side of the silicon substrate 7 in the embedded layer 8 for positioning constituent elements in the area of image pickup. The embedded layer 8 is composed of a material which is other than the material of the silicon substrate 7 and passes the light of a specific wavelength range so that, when the light of the specific wavelength range is made incident from the back side face of the silicon substrate 7, the reflected light from the alighnment mark 6 originated from the above light is detected from the exposed surface of the back side face.

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