Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4586878
Kind Code:
B2
Inventors:
Masahiro Hayashi
Go Shiino
Go Shiino
Application Number:
JP2008116767A
Publication Date:
November 24, 2010
Filing Date:
April 28, 2008
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/02
Domestic Patent References:
| JP4352314A | ||||
| JP4061110A | ||||
| JP3018042A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka
Osamu Suzawa
Kazuhiko Miyasaka