Title:
コイルスパッタ分布を制御するための可変インピーダンスの使用
Document Type and Number:
Japanese Patent JP4611465
Kind Code:
B2
Abstract:
Variable reactances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to "time-averaging" of the RF voltage distributions along the RF coil.
Inventors:
Ryubo Hong
Application Number:
JP17376998A
Publication Date:
January 12, 2011
Filing Date:
May 18, 1998
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/285; C23C14/34; H05H1/46; C23C14/54; H01F29/10; H01J37/32
Domestic Patent References:
| JP7018433A | ||||
| JP8227878A | ||||
| JP8264297A | ||||
| JP8088097A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda adult
Junji Kashiwaoka
Tatsuya Shioda
Shiro Terasaki
Yuichi Yamada
Okimoto Kazuaki
Ikeda adult
Junji Kashiwaoka
Tatsuya Shioda
Shiro Terasaki
Yuichi Yamada
Okimoto Kazuaki