Title:
積層型半導体装置用キャリア構成、この製造方法及び積層型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4613367
Kind Code:
B2
Abstract:
A method of producing a carrier structure for fabricating a stacked-type semiconductor device includes laminating thin plates for a lower carrier associated with an upper carrier. The method includes forming openings in the thin plates by etching or electric discharge machining. The lower carrier includes a magnet that is buried therein and the magnet maintains contact between the lower carrier and the upper carrier. A thin plate of the laminated thin plates is provided on each opposing surface of the magnet. The lower carrier further includes multiple magnets arranged around a periphery of the lower carrier and through a center region of the lower carrier that is between magnets on the periphery.
Inventors:
Masanori Onodera
Koichi Meguro
Junichi Kasai
Yasuhiro Shinma
Koji Taya
Junji Tanaka
Koichi Meguro
Junichi Kasai
Yasuhiro Shinma
Koji Taya
Junji Tanaka
Application Number:
JP2006531192A
Publication Date:
January 19, 2011
Filing Date:
August 30, 2004
Export Citation:
Assignee:
Spansion LLC
International Classes:
H01L25/065; H01L25/04; H01L25/07; H01L25/18
Domestic Patent References:
| JPH1145956A | 1999-02-16 | |||
| JP2003289120A | 2003-10-10 | |||
| JPH11251483A | 1999-09-17 | |||
| JPH03280496A | 1991-12-11 | |||
| JPH0574978A | 1993-03-26 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa