Title:
レーザ加工システム及びこのレーザ加工システムを用いたレーザ加工方法
Document Type and Number:
Japanese Patent JP4615661
Kind Code:
B2
Abstract:
The object of this invention is to provide a laser beam machining system and a laser beam machining method, wherein the working environment for the laser beam machining in the safety cabin is not impaired, and carrying out of the machined work can be performed without causing a shift of the machined work on the machining table, and also, without the laser beam machining being suspended, thereby enabling improvement in the productivity. At least one carriage of two, first and second carriages ( 11 ), ( 19 ) placed in a safety cabin ( 29 ) is moved back and forth above a machining table, and a laser machining head provided in that carriage is moved right and left, to thereby perform laser beam machining with respect to a work (W) on a machining table ( 7 or 9 ). The second carriage is moved back and forth above the machining table ( 7 or 9 ), so that a holding device ( 25 ) provided in the second carriage is moved right and left, to thereby hold and carry the machined work (W). Features of double carriages ( 11, 19 ) in the safety cabin ( 29 ) can be fully utilized, enabling improvement in the productivity.
Inventors:
Ichiro Egashira
Application Number:
JP2000051879A
Publication Date:
January 19, 2011
Filing Date:
February 28, 2000
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B23K37/00; B23K26/10; F16P1/06; B23Q7/04
Domestic Patent References:
| JP4309485A | ||||
| JP6005786U | ||||
| JP7112289A | ||||
| JP8141773A | ||||
| JP9057438A | ||||
| JP10029078A | ||||
| JP10052787A | ||||
| JP10225725A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu