Title:
端子構造及びその製造方法
Document Type and Number:
Japanese Patent JP4617421
Kind Code:
B2
Inventors:
Nagai Manabu
Application Number:
JP2007257505A
Publication Date:
January 26, 2011
Filing Date:
October 01, 2007
Export Citation:
Assignee:
Tamagawa Seiki Co., Ltd.
International Classes:
H02K3/50; H02K5/22; H02K15/04; H02K24/00
Domestic Patent References:
JP2004135430A | ||||
JP2003115407A | ||||
JP55039637A | ||||
JP3155300A | ||||
JP2007035424A |
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Masahiro Taguchi
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Masahiro Taguchi