Title:
はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ
Document Type and Number:
Japanese Patent JP4617485
Kind Code:
B2
Inventors:
Hori Mitsuo
Application Number:
JP2004382545A
Publication Date:
January 26, 2011
Filing Date:
December 13, 2004
Export Citation:
Assignee:
Nano Join Co., Ltd.
Nikka Trading Co., Ltd.
Nikka Trading Co., Ltd.
International Classes:
B23K35/26; C22C13/00; H01G4/18
Domestic Patent References:
| JP2000015478A | ||||
| JP2001246493A | ||||
| JP2002248596A |
Attorney, Agent or Firm:
Hiroshi Hori