Title:
ダイシング・ダイボンドフィルム
Document Type and Number:
Japanese Patent JP4628479
Kind Code:
B2
Abstract:
A dicing die-bonding film of the present invention has a dicing film having a pressure-sensitive adhesive layer (2) on a base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed from an acrylic polymer comprising an acrylic ester A represented by CH 2 =CHCOOR 1 (wherein R 1 is an alkyl group having 6 to 10 carbon atoms), an acrylic ester B represented by CH 2 =CHCOOR 2 (wherein R 2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule, the compounded ratio of the acrylic ester A and the acrylic ester B is 40 to 10 mol% of the acrylic ester B to 60 to 90 mol% of the acrylic ester A, the compounded ratio of the hydroxyl group-containing monomer is in a range of 10 to 30 mol% to 100 mol% of the total of the acrylic ester A and the acrylic ester B, the compounded ratio of the isocyanate compound is in a range of 70 to 90 mol% to 100 mol% of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.
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Inventors:
Katsuhiko Kamiya
Ken Matsumura
Shuhei Murata
Hirohisa Otake
Ken Matsumura
Shuhei Murata
Hirohisa Otake
Application Number:
JP2009178028A
Publication Date:
February 09, 2011
Filing Date:
July 30, 2009
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/22; C09J7/30; C09J7/38; C09J133/08; H01L21/52
Domestic Patent References:
| JP2005005355A | ||||
| JP10060391A | ||||
| JP7263381A | ||||
| JP2010062542A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office