Title:
半導体処理装置の窒化ホウ素とイットリアとの複合材料の構成部品及びその製造方法
Document Type and Number:
Japanese Patent JP4634005
Kind Code:
B2
Abstract:
A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a boron nitride/yttria composite containing surface and process for manufacture thereof.
Inventors:
O'Donnell, Robert, Jay.
Chan, Christopher, Shee.
Dowel Tea, John, Yi.
Chan, Christopher, Shee.
Dowel Tea, John, Yi.
Application Number:
JP2002554295A
Publication Date:
February 16, 2011
Filing Date:
November 23, 2001
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
C23C30/00; C23C16/44; H01J37/32; H01L21/205; H01L21/3065
Foreign References:
| WO2000007216A1 | ||||
| WO1999020812A1 |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Nishikawa Keio
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Nishikawa Keio