Title:
電子機器用筐体の製造方法
Document Type and Number:
Japanese Patent JP4642071
Kind Code:
B2
Abstract:
A method of manufacturing a casing for an electronic apparatus, comprising the steps of with the use of injection molding die (1) having a combination of common mold (4) and exchangeable mold (2,3) so as to be able to form primary molding cavity (11) and secondary molding cavity (12), disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin that has a visible light transmittance of 80% or more defined in JIS-K7105 and pencil hardness of F or more defined in JIS-K5600-5-4 thereby obtain primary mold product (53) corresponding to a transparent window portion and simultaneously bonding the decorative layer of the transfer material; and subsequently injecting a resin that has a Izod impact strength 10 KJ/M 2 or more defined ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary mold product disposed to thereby form secondary mold product (54) fixed to the primarymold product and simultaneously bonding the decorative layer of the transfer material; and detaching the transfer material from the primary mold product and secondary mold product.
Inventors:
Hamaoka Koichi
Application Number:
JP2007507156A
Publication Date:
March 02, 2011
Filing Date:
March 08, 2006
Export Citation:
Assignee:
NISSHA PRINTING CO.,LTD.
International Classes:
B29C45/14; B29C45/16
Domestic Patent References:
| JPH1044190A | 1998-02-17 | |||
| JPS62108019A | 1987-05-19 | |||
| JPH0788887A | 1995-04-04 |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mitsuo Wada
Mitsuo Tanaka
Mitsuo Wada