Title:
熱可塑性樹脂組成物
Document Type and Number:
Japanese Patent JP4645809
Kind Code:
B2
Abstract:
Disclosed is a thermoplastic resin composition containing a thermoplastic resin (A) having a functional group reactive with epoxy groups, a polymer (B) having an epoxy group and a catalyst (C) for accelerating reactions of the functional group reactive with epoxy groups and the epoxy group. The content of the polymer (B) is set at 0.1-5 parts by mass per 100 parts by mass of the thermoplastic resin (A), while the content of the catalyst (C) is set at from 1.0 × 10-6 to 50 × 10-6 parts by mass per 100 parts by mass of the thermoplastic resin (A). Also disclosed is a molded article obtained by molding, for example extrusion molding the thermoplastic resin composition.
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Inventors:
Furuta Yen
Application Number:
JP2004373265A
Publication Date:
March 09, 2011
Filing Date:
December 24, 2004
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
C08L101/00; C08G59/00; C08J3/22; C08K5/098; C08L25/08; C08L67/00
Domestic Patent References:
| JP63128059A | ||||
| JP2004155968A | ||||
| JP2005105059A |
Foreign References:
| WO2001094443A1 |