To obtain a silicone adhesive composition that does not contain an aromatic hydrocarbon solvent and prevents contamination of electronic/electric parts, an influence on the human body and skin irritation by a residual or volatile substance.

The peroxide curable silicone adhesive composition comprises (A) a polydiorganosiloxane, (B) a polyorganosiloxane containing an R13SiO0.5unit and an SiO2unit and having the molar ratio of the R13SiO0.5unit/the SiO2unit of 0.6-1.7, (C) an organic peroxide curing agent and (D) an aliphatic organic solvent. In the addition reaction type silicone adhesive composition comprising (A') a polydiorganosiloxane containing two or more alkenyl groups in one molecule, (B) the same polyorganosiloxane as mentioned above, (E) an SiH group-containing polyorganosiloxane, (F) a control agent, (G) an addition reaction catalyst and (D) an aliphatic organic solvent, (B) the component is produced without using an aromatic hydrocarbon solvent.

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