Title:
基板表面をパターニングする方法
Document Type and Number:
Japanese Patent JP4649412
Kind Code:
B2
Abstract:
An elastomeric stamp has a bulk surface from which protruding features extend. A barrier layer covers the bulk surface and the protruding features. After applying an ink solution to the elastomeric stamp and drying the elastomeric stamp, the elastomeric stamp is brought into contact with a surface of a first substrate. The surface of the first substrate has a high affinity with the ink molecules, which is utilized to effectively remove the ink molecules from the contact surfaces of the protruding features. Subsequently, the elastomeric stamp is brought into contact with the surface of a second substrate. Ink molecules are transferred from the edges of the protruding features to the surface of a second substrate, thus forming an ink pattern in the form of a self assembled monolayer on this surface.
Inventors:
Dirk, Burdinsky
Ruben, B. A. Sharp
Ruben, B. A. Sharp
Application Number:
JP2006530986A
Publication Date:
March 09, 2011
Filing Date:
October 07, 2004
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
C23F1/00; G03F7/00; H05K3/06; B05D1/28
Foreign References:
| WO2002085639A1 |
Other References:
Langmuir,2002年,Vol.18,pp.7029-7034
Appl. Phys. Let.,1993年,Vol.63, No.14,pp.2002-2004
Langmuir,2003年 5月20日,Vol.19,pp.5475-5483
Appl. Phys. Let.,1993年,Vol.63, No.14,pp.2002-2004
Langmuir,2003年 5月20日,Vol.19,pp.5475-5483
Attorney, Agent or Firm:
Tadahiko Ito
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki