Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4653447
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode pads, on the main surface; forming a sealing resin over the main surface; grinding the top face of the sealing resin for exposing the top faces of the contact portions; polishing the top face of the sealing resin by blast processing for exposing the side of the contact portions; and forming external terminals connected with the contact portions exposing from the sealing resin.
Inventors:
Yoshinori Kashino
Application Number:
JP2004262065A
Publication Date:
March 16, 2011
Filing Date:
September 09, 2004
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H01L23/12; H01L21/60
Domestic Patent References:
| JP2003234430A | ||||
| JP2003133473A | ||||
| JP2000200800A | ||||
| JP2002185097A | ||||
| JP2000269371A | ||||
| JP2002100709A | ||||
| JP2004247612A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda