Title:
リソグラフィー用ギャップフィル材形成組成物
Document Type and Number:
Japanese Patent JP4654544
Kind Code:
B2
Abstract:
A composition for forming a gap-filling material for lithography which, as a gap-filling material for lithography superior in planarization ability on a substrate having irregularities such as holes or trenches, causing no intermixing with a resist layer, and having a high dry etching rate as compared with the resist, is used in producing semiconductor devices by a method using the gap-filling material to cover the resist on the substrate having holes having an aspect ratio, defined as height/diameter, of 1 or more to transfer images onto the substrate by utilization of lithographic process, the composition being used to coat the substrate prior to the coating of the resist so as to planarize the substrate surface, and the composition being characterized by containing a polymer solution consisting of a polymer and a solvent.
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Inventors:
Takei Satoshi
Kenichi Mizusawa
Yonehisa Sone
Kenichi Mizusawa
Yonehisa Sone
Application Number:
JP2001207811A
Publication Date:
March 23, 2011
Filing Date:
July 09, 2001
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
G03F7/11; C08L25/18; C09D125/18; G03F7/09
Domestic Patent References:
| JP61070720A | ||||
| JP2000164701A | ||||
| JP7333854A | ||||
| JP5107767A | ||||
| JP6267810A | ||||
| JP62056947A | ||||
| JP61180241A |
Foreign References:
| US6057239 |