Title:
電子部品装着装置
Document Type and Number:
Japanese Patent JP4667113
Kind Code:
B2
Inventors:
Tomizawa Yoshio
Application Number:
JP2005132341A
Publication Date:
April 06, 2011
Filing Date:
April 28, 2005
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
H05K13/02
Domestic Patent References:
| JP2005166878A | ||||
| JP2002151888A | ||||
| JP2004228251A | ||||
| JP3003397A |
Attorney, Agent or Firm:
Kiyotaka Aizawa