Title:
電池パック、およびその製造方法
Document Type and Number:
Japanese Patent JP4667652
Kind Code:
B2
Abstract:
A circuit assembly includes a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first substrate to the second substrate. The joint member includes a set of separated leads extending generally parallel to each other, and a first and a second retainers transversely connecting the leads to each other. The first and the second retainers are formed by molding a resin so that they are integral with the leads by allowing the molding resin to enter the spaces between the leads.
Inventors:
Satoshi Nakamura
Application Number:
JP2001177271A
Publication Date:
April 13, 2011
Filing Date:
June 12, 2001
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01M50/528; H05K1/14; H05K3/36; H01R43/16; H01R43/20
Domestic Patent References:
| JP77073U | ||||
| JP8329913A | ||||
| JP831475A |
Foreign References:
| WO2000065888A1 |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Yoshikazu Fukumoto
Tatsuya Tanaka
Yoshikazu Fukumoto