Title:
加工装置、加工方法、欠陥修正装置、欠陥修正方法及びパターン基板の製造方法。
Document Type and Number:
Japanese Patent JP4674365
Kind Code:
B2
Inventors:
Kenshi Ishiwata
Teruaki Yamazaki
Hirokazu Seki
Toshio Uchiyama
Teruaki Yamazaki
Hirokazu Seki
Toshio Uchiyama
Application Number:
JP2005373822A
Publication Date:
April 20, 2011
Filing Date:
December 27, 2005
Export Citation:
Assignee:
Lasertec Co., Ltd.
International Classes:
G02F1/1333; G02F1/13
Domestic Patent References:
| JP6313871A | ||||
| JP7175028A |
Attorney, Agent or Firm:
Ken Ieiri