Title:
チップクランプ装置およびスローアウェイ式切削工具
Document Type and Number:
Japanese Patent JP4683930
Kind Code:
B2
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Inventors:
Yoshiharu Sawada
Application Number:
JP2005006807A
Publication Date:
May 18, 2011
Filing Date:
January 13, 2005
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B23B27/16
Domestic Patent References:
| JP54174082U | ||||
| JP642001U | ||||
| JP2002160109A | ||||
| JP4069821B2 |