Title:
二段式の予熱器、はんだ付け又ははんだ除去の方法及びキット、並びに、電子部品実装システム
Document Type and Number:
Japanese Patent JP4685793
Kind Code:
B2
Abstract:
A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises: a first stage configured to direct heat over a wide area of the printed circuit board; and a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
Inventors:
Ho, Albert
Carlo Magno, Mike
Sewing machine, artem
Carlo Magno, Mike
Sewing machine, artem
Application Number:
JP2006538039A
Publication Date:
May 18, 2011
Filing Date:
October 13, 2004
Export Citation:
Assignee:
DELAWARE CAPITAL FORMATION,INC.
International Classes:
H05K3/34; H05K13/04
Domestic Patent References:
| JP5384174A | ||||
| JP2002331358A |
Foreign References:
| DE19716392A1 | ||||
| WO2003041480A1 | ||||
| US6201930 | ||||
| FR2573950A1 |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura