Title:
パワー半導体アセンブリ
Document Type and Number:
Japanese Patent JP4685884
Kind Code:
B2
Abstract:
A semiconductor assembly is disclosed. One embodiment provides a first semiconductor and a second semiconductor, each having a first main connection and a second main connection arranged on opposite sides, and a carrier having a patterned metallization with a first section spaced apart from a second section. The first semiconductor is electrically connected to the first section by its second main connection, and the second semiconductor electrically connected to the second section by its second main connection. The first semiconductor chip first main connection and the second semiconductor chip first main connection are electrically connected to one another and for the connection of an external load or of an external supply voltage.
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Inventors:
Bierror, reinhold
Toben, Marx
Toben, Marx
Application Number:
JP2007555474A
Publication Date:
May 18, 2011
Filing Date:
January 19, 2006
Export Citation:
Assignee:
Infineon Technologies AG
International Classes:
H01L23/40; H02M7/48; H02M7/5387
Domestic Patent References:
| JP57196879A | ||||
| JP2004040899A | ||||
| JP60054342U | ||||
| JP7256147A | ||||
| JP10289999A | ||||
| JP2000125560A | ||||
| JP2001085612A | ||||
| JP2002043508A | ||||
| JP2002093995A | ||||
| JP2002314082A | ||||
| JP2004140068A | ||||
| JP2004186504A | ||||
| JP2005184891A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office