半導体装置の製造方法

Title:

半導体装置の製造方法

Document Type and Number:

Japanese Patent JP4686920

Kind Code:

B2

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Inventors:

Kiyoshi Takeuchi

Application Number:

JP2001217108A

Publication Date:

May 25, 2011

Filing Date:

July 17, 2001

Export Citation:

Assignee:

NEC

International Classes:

H01L21/8238; H01L21/8234; H01L27/08; H01L27/088; H01L27/092

Domestic Patent References:

Attorney, Agent or Firm:

Shiroyuki Hori

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