Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4687742
Kind Code:
B2
Inventors:
Akagi Nozomi
Yasuhiro Kitamura
Tetsuo Fujii
Yasuhiro Kitamura
Tetsuo Fujii
Application Number:
JP2008106014A
Publication Date:
May 25, 2011
Filing Date:
April 15, 2008
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/76; H01L21/762; H01L21/8234; H01L27/06; H01L27/08; H01L27/088; H01L27/12; H01L29/78; H01L29/786
Domestic Patent References:
| JP10027767A | ||||
| JP2002523900A | ||||
| JP2004179670A | ||||
| JP2006310726A | ||||
| JP2007035729A | ||||
| JP62130537A | ||||
| JP5067676A | ||||
| JP2006019428A | ||||
| JP1129441A | ||||
| JP2008166705A |
Foreign References:
| US4612408 |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Taihei Nonobe