Title:
半導体素子の冷却構造
Document Type and Number:
Japanese Patent JP4694514
Kind Code:
B2
Abstract:
A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.
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Inventors:
Tadashi Yoshida
Yuji Nagata
Yokoi Yutaka
Yuji Nagata
Yokoi Yutaka
Application Number:
JP2007028773A
Publication Date:
June 08, 2011
Filing Date:
February 08, 2007
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
Toyota Central R & D Labs.
Toyota Central R & D Labs.
International Classes:
H01L23/473; H01L23/36; H05K7/20
Domestic Patent References:
| JP2005150419A | ||||
| JP2005093848A | ||||
| JP8148618A | ||||
| JP2002270765A | ||||
| JP2003142864A |
Foreign References:
| WO2005071824A1 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Tadashi Muto
Yutaka Horii
Nobuo Arakawa
Toshio Morita
Tadashi Muto
Yutaka Horii
Nobuo Arakawa