半導体装置およびその製造方法 - Renesas Electronics Corporation

Title:

半導体装置およびその製造方法

Document Type and Number:

Japanese Patent JP4695842

Kind Code:

B2

Inventors:

Soji Shuji

Application Number:

JP2004016479A

Publication Date:

June 08, 2011

Filing Date:

January 26, 2004

Export Citation:

Assignee:

Renesas Electronics Corporation

International Classes:

H01L21/768; H01L21/304; H01L23/522

Domestic Patent References:

Attorney, Agent or Firm:

Shinji Hayami

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