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Patent Searching and Data


Title:
密封装置
Document Type and Number:
Japanese Patent JP4696415
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sealing device which can suppress temperature rise at a lip portion and has improved dust resistance and water resistance. SOLUTION: The sealing device comprises a main lip portion 4a which is provided on a first annular member 2 and forms a minute gap S2 in the neighborhood of an outside peripheral surface of a second annular member 6 or a shaft member, and a seal lip 8a which is formed so as to face each other on the O side of the main lip 4a opposed to a sealed object and seals the radially extended gap between a radial part 4b (a radial part 3b) of a first reinforcing annulus 3 and a third reinforcing annulus 7.

Inventors:
Tetsuro Tasaki
Application Number:
JP2001222036A
Publication Date:
June 08, 2011
Filing Date:
July 23, 2001
Export Citation:
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Assignee:
NOK CORPORATION
International Classes:
F16C33/78; F16J15/3244
Domestic Patent References:
JP5196146A
JP60091846U
JP40013772Y1
JP3105769U
Attorney, Agent or Firm:
Kazunobu Sera
Mayuko Wakuda