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Title:
プラズマを径方向に均一に分布する容量結合プラズマリアクタ
Document Type and Number:
Japanese Patent JP4698222
Kind Code:
B2
Abstract:
A plasma reactor for processing a semiconductor wafer includes a side wall and an overhead ceiling defining a chamber, a workpiece support cathode within the chamber having a working surface facing the ceiling for supporting a semiconductor workpiece, process gas inlets for introducing a process gas into the chamber and an RF bias power generator having a bias power frequency. There is a bias power feed point at the working surface and an RF conductor is connected between the RF bias power generator and the bias power feed point at the working surface. A dielectric sleeve surrounds a portion of the RF conductor, the sleeve having an axial length along the RF conductor, a dielectric constant and an axial location along the RF conductor, the length, dielectric constant and location of the sleeve being such that the sleeve provides a reactance that enhances plasma ion density uniformity over the working surface. In accordance with a further aspect, the reactor can include an annular RF coupling ring having an inner diameter corresponding generally to a periphery of the workpiece, the RF coupling ring extending a sufficient portion of a distance between the working surface and the overhead electrode to enhance plasma ion density near a periphery of the workpiece.

Inventors:
Yang, Jean, Gyo
Hoffman, Daniel, Jay.
Carducci, James, Dee.
Backburger, Douglas, A., Junior
Hagan, Robert, Bee.
Miller, Matthew, Elle.
Chan, Kang Lee
Del Gadino, Gerrard, A.
Application Number:
JP2004534479A
Publication Date:
June 08, 2011
Filing Date:
September 03, 2003
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/3065; H01J37/32; H05H1/46
Domestic Patent References:
JP2001319920A
JP2001185542A
JP2003514389A
JP4247878A
JP4000901A
JP2002100622A
JP1218106A
JP2002203840A
Foreign References:
WO2001037315A1
WO2001071765A1
Attorney, Agent or Firm:
Yoshiaki Anzai