Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP4700114
Kind Code:
B2
Abstract:
A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
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Inventors:
Murakami Masahiro
Masahiko Kushino
Exit Meiki
Yoshihisa Amano
Masahiko Kushino
Exit Meiki
Yoshihisa Amano
Application Number:
JP2009027992A
Publication Date:
June 15, 2011
Filing Date:
February 10, 2009
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L23/02; H01L25/04; H01L25/18
Domestic Patent References:
| JP1117070A | ||||
| JP2003347354A | ||||
| JP2006339590A |
Attorney, Agent or Firm:
Shizuo Sano
Inoue On
Inoue On