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Title:
膜モジュール支持装置
Document Type and Number:
Japanese Patent JP4700974
Kind Code:
B2
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Inventors:
Genaki Hirota
Haruo Hamano
Application Number:
JP2005033835A
Publication Date:
June 15, 2011
Filing Date:
February 10, 2005
Export Citation:
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Assignee:
Shimizu Alloy Co., Ltd.
International Classes:
B01D65/00
Domestic Patent References:
JP7299456A
JP8117572A
JP57007203A
JP2004267842A
Attorney, Agent or Firm:
Akihiro Takeda



 
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