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Title:
PCB含有物の処理方法
Document Type and Number:
Japanese Patent JP4701295
Kind Code:
B2
Abstract:

To provide a method and an apparatus for treating a PCB-containing material which can efficiently and safely treat discarded electrical apparatus containing a small amount of PCB.

In the method of treating PCB-containing material, a PCB-containing liquid contained in the PCB-containing material is heated for one hour or more at 550-850°C by a fixed bed furnace to volatize and remove PCB together with the PCB-containing liquid from the PCB-containing material. Otherwise, in the method of treating the PCB-containing material, the PCB-containing liquid contained in the PCB-containing material is heated for one hour or more at 550-850°C by a continuous furnace to volatize and remove PCB together with the PCB-containing liquid from the PCB-containing material.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
Ryotsugu Ito
Kenichi Sato
Kubo Susumu
Takeshi Ikeda
Mutsumi Kano
Manabu Murakami
Yoichi Fukuchi
Yoshihiro Ishihama
Nobuo Ohtake
Takeshi Tayama
Application Number:
JP2009085551A
Publication Date:
June 15, 2011
Filing Date:
March 31, 2009
Export Citation:
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Assignee:
DOWA ECO-SYSTEM Co., Ltd.
International Classes:
B09B3/00; F23G7/00
Domestic Patent References:
JP2002233848A
JP7217850A
JP2002195530A
JP2008508174A
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda



 
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