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Title:
レーザー切断用厚鋼板とその製造方法
Document Type and Number:
Japanese Patent JP4702254
Kind Code:
B2
Abstract:

To provide a thick steel plate to be laser-cut which hardly causes a cutting trouble even when the laser cutting machine is used for an unattended operation during night and has superior adhesiveness of scale, and to provide a production method therefor.

The thick steel plate to be laser-cut contains, by mass%, 0.02 to 0.4% Si, has a thickness of 15 to 35 mm, and has a scale layer of 10 to 60 μm on the surface, wherein the scale layer in an amount of 80% or more remains after a bending strain of 3% has been applied thereto. The thick steel plate may include a specified amount of C, Mn, Cu, Ni, P, S, Al and N, or further Cr, Mo, Nb, V, Ti, B, Ca, Mg and REM, in addition to Si. The thick steel plate to be laser-cut having the scale layer of 10 to 60 μm on the surface of the steel plate can be produced through the steps of slab forming, heating, descaling, rolling, water cooling, flatness conditioning and radiational cooling.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Satoshi Kubo
Atsushi Kosegawa
Yukio Onuma
Hikaru Okada
Takao Maeda
Takayuki Uemura
Tomoya Fujiwara
Application Number:
JP2006279532A
Publication Date:
June 15, 2011
Filing Date:
October 13, 2006
Export Citation:
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Assignee:
SUMITOMO METAL INDUSTRIES,LTD.
International Classes:
C22C38/00; B21B1/38; B21B3/00; C21D8/02; C22C38/16; C22C38/58
Domestic Patent References:
JP2006219712A
JP2004204346A
JP2005271074A
JP2003221640A
JP2002332541A
JP2004169093A
Attorney, Agent or Firm:
Mikiji Sugioka
Terutada Hogami
Chihara



 
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