To provide a device and a method of alignment for accurately superposing a substrate and a mask.
Virtual lines L3 and L4 for respectively connecting substrate marks 1a and 1a and substrate angle marks 1b and 1b of a glass substrate 1 are parallel to each other. Virtual points 1c and 1c located on respective virtual perpendicular lines L7 and L8 for the virtual lines L3 and L4 are respectively specified to be point-symmetrical with respect to a center point P1 of the glass substrate 1. While the glass substrate 1 and a metal mask 2 are overlappingly placed, the substrate marks 1a and 1a, the substrate angle marks 1b and 1b, and mask marks 2a and 2a are acquired as measurement images by cameras 4A and 4B. Coordinate values of the virtual points 1c and 1c and coordinate values of the mask marks 2a and 2a are calculated from the measurement images. Respective center coordinate values P11 and P21 of line segments L12 and L11 each connecting the coordinates are calculated from the coordinate values. The differential value of the coordinates is obtained. The differential value is used as a correction value to align the glass substrate 1 with the metal mask 2 in position.
COPYRIGHT: (C)2008,JPO&INPIT
Shinichi Nishiwaki
Mitsuyuki Tajima
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Yuji Chihara