Title:
半導体装置
Document Type and Number:
Japanese Patent JP4731495
Kind Code:
B2
Abstract:
Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball.
Inventors:
Eiji Hayashi
Application Number:
JP2006548593A
Publication Date:
July 27, 2011
Filing Date:
December 13, 2004
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L23/12
Domestic Patent References:
| JP2000040713A | 2000-02-08 | |||
| JP2004188497A | 2004-07-08 | |||
| JP2003168706A | 2003-06-13 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita