Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4738971
Kind Code:
B2
Abstract:
A semiconductor device includes a semiconductor chip having a plurality of electrode pads, and a rewiring pattern having a plurality of interconnects connected to the electrode pads and extending over insulation film. The semiconductor device includes a plurality of columnar electrodes each having a main body section and a protrusion section, and a sealing section having a top face having a height the same as the top faces of the protrusion sections. The semiconductor device includes solder balls formed on the protrusion sections and has a plurality of trenches in the sealing section. Each trench has a depth which reaches the boundary between the main body and protrusion of the electrode. The side faces of the protrusion section are exposed by the trenches. Each solder ball is electrically connected to the top and side faces of the protrusion section of each electrode.
Inventors:
Tadashi Yamaguchi
Application Number:
JP2005300576A
Publication Date:
August 03, 2011
Filing Date:
October 14, 2005
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H01L23/12
Domestic Patent References:
| JP2001077142A | ||||
| JP2000353766A | ||||
| JP4335542A | ||||
| JP2000183094A |
Attorney, Agent or Firm:
Takashi Ogaki
Hiroyuki Okada
Hiroyuki Okada