Title:
半導体装置
Document Type and Number:
Japanese Patent JP4742414
Kind Code:
B2
More Like This:
Inventors:
Toyozawa Naoko
Application Number:
JP2000304430A
Publication Date:
August 10, 2011
Filing Date:
October 04, 2000
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/22; C08K9/06; C08G59/32; C08G59/40; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2210853A | ||||
| JP2000212395A | ||||
| JP2000129092A | ||||
| JP11140277A | ||||
| JP11323089A | ||||
| JP10007771A | ||||
| JP61082438A |