Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
電子回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP4746557
Kind Code:
B2
Abstract:
A production process for making an electronic circuit substrate comprising: a patterning step of forming a respectively anodically oxidizable conductor pattern and distribution pattern connected to the conductor pattern on a substrate; and an anodic oxidation step of generating an oxide film from the conductor pattern and the distribution pattern by contacting an electrolyte solution with the conductor pattern and the distribution pattern and carrying out anodic oxidation while applying current thereto, the patterns serving as anodes, wherein the width or film thickness of the distribution pattern is at least partially set so that an insulator portion is formed in the anodic oxidation step in which an oxide film formed on one of the side walls of the distribution pattern is integrated with an oxide film formed on the other side wall.

Inventors:
Takashi Nakama
Satoru Daejeon
Satoshi Miyaguchi
Application Number:
JP2006543275A
Publication Date:
August 10, 2011
Filing Date:
October 21, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Pioneer Corporation
International Classes:
G09F9/30; H01L21/336; H01L27/32; H01L29/786; H01L51/50; H05B33/10; H05B33/26
Domestic Patent References:
JPH05222581A1993-08-31
JPH07193344A1995-07-28
JPH08321620A1996-12-03
JPH05343688A1993-12-24
JPH02116831A1990-05-01
JPH0982977A1997-03-28
JPS61100971A1986-05-19
JPS6486113A1989-03-30
JPH0443328A1992-02-13
JP2003255857A2003-09-10
Attorney, Agent or Firm:
Motohiko Fujimura