To provide a technology by which a detailed and highly reliable multilayer wiring structure can be easily formed.

A multilayer wiring structure is obtained by electrically connecting a lower layer wiring with an upper layer wiring arranged at an upper part of the lower wiring via an insulating layer through a protrusion provided at the lower layer wiring. The protrusion is formed at a cylindrical conductive member and upper and lower layers thereof and is configured by a conductive layer formed over the whole lower layer wiring, and the upper layer wiring is electrically connected with the lower layer wiring at a place where the protrusion is exposed on almost the same plane as an upper plane of the insulating layer.

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